DirectFET功率封装技术适用于电脑，笔记本电脑，通讯设备和消费电子产品交流-直流和直流-直流电源|稳压器转换装置，是一个很好的表面贴装功率MOSFET封装技术，采用SO -包大小为8或更小大小的一个很有效的冷却顶部。相对于标准的塑料分离的DirectFET的“金属帽”结构可实现双面冷却，高频直流-直流降压转换器加倍的电流处理能力。

英飞凌将的OptiMOS 2和的OptiMOS 3芯片采用DirectFET功率封装技术，并预计在2008年初开始使用的DirectFET封装的OptiMOS 2产品样品供应。国际整流器

商用电源产品部副总裁Tim Phillips表示：“IR的DirectFET封装技术采用了独特的双面散热设计，在计算机，消费电子和通信产品中使用的电子设备降低功耗，减少尺寸{sx}的解决方案。我们将不断开发先进的节能技术，并通过签订许可协议，扩大创新的DirectFET把节能技术，而我们的商业电源转换器，进一步提高的{zd0}电源管理市场“。

英飞凌科技和电源管理与驱动产品事业部总经理产品Arunjai米塔尔高级副总裁说：通过签署技术许可协议”，英飞凌能够继续扩大其功率半导体产品线。我们会成熟的OptiMOS芯片技术应用到各种不同的应用组合包装过程中，使设计人员的设计能力为能源效率和成本效益的解决方案。的OptiMOS 2和的OptiMOS 3高性能的芯片双特定产品，双面冷却封装技术，将进一步加强英飞凌的转换在市场的功能状态。“

Infineon International Rectifier authorized use DirectFET packaging technology

DirectFET power packaging technology applicable to computers, notebooks, communications equipment and consumer electronics products communicate - DC and DC - DC power | voltage regulator conversion device, is a very good surface mount power MOSFET packaging technology, in the SO - Package size 8 or smaller size on top of a very effective cooling. Compared with the standard separation of plastic, DirectFET’s “metal cap” structure can realize double-sided cooling, the high-frequency DC - DC step-down converter doubling the current handling capacity.

Infineon will OptiMOS 2 and OptiMOS 3 chip using DirectFET power package technology, and is expected to start in early 2008 the supply of used DirectFET package OptiMOS 2 Product samples. International Rectifier

Commercial Power Products Division, Vice President Tim Phillips said: “International Rectifier’s DirectFET packaging technology using a unique double-sided cooling design, are used in computers, consumer electronics and communications products electronic devices reduce power consumption, reducing the size of the preferred solution. We will constantly develop cutting-edge energy-saving technology and, through the signing of the license agreement, and expand innovative DirectFET bring energy-saving technology, while further increases in our commercial power converters that The largest power management market segments. “

senior vice president of Infineon Technologies and Power Management and Drives Business Unit General Manager of Product Arunjai Mittal added:” By signing the technology license agreement, Infineon can continue to expand its power semiconductor product line-up. We will mature OptiMOS chip technology applied to a variety of different applications combine packaging process will enable power designers to design specific products for energy efficiency and cost-efficient solutions. OptiMOS 2 and OptiMOS 3 chip with high performance double-sided cooling packaging technology, will further strengthen Infineon’s conversion in the functional status of the market. “(07-11-27)