拓墣产业研究所（TopologyResearchInstitute）公布的全球半导体行业的调查报告，2008年国内生产总值预计将达到2007年全球半导体二千七百五十二万点零零万美元，年增长率将是一个显着上升2.87％，2008年至8％。并有效地参与到全球的半导体类股，调制解调器和制造商外包的比例，以提高北京奥运商机催生了2008年台湾IC产值新台币高达1万亿7000亿美元，18.9％的年增长率，远远优于，全球IC产业的表现。

在半导体行业库存逐步调整之际，加上主要IDM公司都变成了轻晶圆厂或轰击以下，将推动IC产业预计将外发的趋势，作为全球{lx1}的结果晶圆代工厂与IC封装测试企业台湾预计将台湾的输出波外包的{zd0}受益者的需要。

此外，北京奥运会和通信所带来的消费，例如数字电视/高清晰度电视，数码相机，MP3播放，全球定位系统，3G移动电话和移动电视产品的需求，但对台湾的IC产业也将带来巨大的商业机会，所以2008年拓扑考虑台湾的整体动能集成电路行业增长将好于世界。预计2008年台湾IC设计4324.000亿新台币，集成电路制造902300000000产量为新台币，IC封装和测试生产总值3863.0亿，而去年同期（公元附加值产品价值上yearpercentage）分别为12％，22％和20％ ，总的集成电路一万七千二百十点零零亿新台币，较去年同期产值的18.9％。
未来高性能和节能
需求，半导体产业将朝向“的高度集成系统”和“缩微胶片的过程，”两个主要的技术趋势。 “阿的系统集成技术”等高度的SoC，SiP和3DIC，除了缩小终端系统产品尺寸，功耗，性能，成本比传统工艺的天才的表现。

“微缩过程”可能会提高，如比上一代65纳米制造工艺45纳米制造工艺的性能和能源效率，降低芯片价格，以提高百分之四十的有效性，同时降低能耗10-20％;部分低功耗制程，45纳米静态（静态）电力和65纳米制造工艺相比，降低率高达50％，并FDSOI（绝缘层耗竭性检讨硅）工艺权力BulkCMOS进程也将减少40％ 。

Topology: in 2008 the performance of Taiwan’s semiconductor industry will be better than the global

Topology Research Institute (TopologyResearchInstitute) published the global semiconductor industry, the survey report, expected in 2008 GDP will reach the global semiconductor 275.2 billion U.S. dollars, an annual growth rate in 2007 will be a significant increase of 2.87% to 8% of 2008. And effectively in the global semiconductor stocks go of, IDM outsourcing ratio and manufacturers to enhance business opportunities in the Beijing Olympics catalyzed, in 2008 Taiwan’s IC production value of NT up to 1 trillion 700 billion, annual growth rate of 18.9%, far superior to the global IC industry performance.

inventory in the semiconductor industry to gradually adjust the occasion, together with the main IDM companies have transformed into FAB-Lite or FAB-less, will drive the IC industry is expected to Out-sourcing trend; as a result of the global leading wafer foundries and IC packaging and testing firms in Taiwan are expected to Taiwan will be the wave of Out-sourcing needs of the greatest beneficiaries.

In addition, the Beijing Olympic Games and communications brought about by consumer demand for products, such as DTV / HDTV, DSC, MP3, GPS, 3G mobile phones and mobile TV, but also for Taiwan’s IC industry will bring huge business opportunities, so consider Topology 2008 Taiwan’s overall IC industry growth of kinetic energy will be better than the world. Projected 2008 production value of Taiwan’s IC design 432,400,000,000 NT, IC manufacturing output value of 902.3 billion for the NT, IC packaging and testing production value of 386.3 billion, while YoY (Year-on-yearpercentage) were 12%, 22% and 20%, the overall IC production value of 1721 billion NT, YoY to 18.9%.

for future high-performance and energy saving needs, the semiconductor industry will develop towards “a high degree of systems integration” and “microfilm process,” the two major technology trend. “A high degree of system integration technology” such as SoC, SiP and 3DIC, in addition to narrowing the Termination System Product size, power consumption, performance, cost performance than the conventional process for the gifted.

“microfilm process” may enhance the performance and energy efficiency and reduce IC prices, such as the 45nm manufacturing process than the previous generation 65nm manufacturing process to enhance the effectiveness of 40 percent, while lowering power consumption 10-20%; part of low-power process, 45nm static (static) power and 65nm manufacturing process as compared to lower the rate is as high as 50%; and FDSOI (insulating layer depletion-wide review of silicon) process power BulkCMOS process will also reduce by 40%. (07-12-3)