常用述语

微组装技术﹕MPT/Microelectronic Packaging technology
混装技术﹕Mixed Component Mounting Technology
封装﹕ Package
贴片﹕ Pick and Place
拆焊﹕ Desoldering
再流﹕Reflow
浸焊﹕ Dip Soldering
拖焊﹕ Drag soldering
印制电路﹕Printed Circuit
印制线路﹕ Printed Wiring
印制电路板﹕ printed circuit board
印制线路板﹕printed wiring board
层压板﹕laminate
覆铜薄层压板﹕copper-clad laminate
基材﹕base material
成品板﹕production board
印刷﹕printing
导电图形﹕conductie pattern
印制组件﹕printed component
单面印制板﹕single-sided printed board
双面印制板﹕double-sided printed board
多层印制板﹕multilayer printed board
电烙铁﹕ Iron
热风嘴﹕ hot air reflowing nozzle
吸锡带﹕soldering wick
吸锡器﹕tin extractor
焊后检验﹕post-soldering inspection
目视检验﹕isual inspection
机器检验﹕ machine inspection
焊点质量﹕ soldering joint quality
焊电缺陷﹕ soldering jont defect
错焊﹕ solder wrong
漏焊﹕ solder skips
虚焊﹕ pseudo soldering
冷焊﹕ cold soldering
桥焊﹕ solder bridge
脱焊﹕ open soldering
焊点剥离﹕ solder off
不润湿焊点﹕ soldering nonwetting
锡珠﹕ solder ball
拉尖﹕ icicle ； solder projection
孔洞﹕ oid
焊料爬越﹕ solder wicking
过热焊点﹕ oerheated solder connection
不饱和焊点﹕ insufficient solder connection
过量焊点﹕ excess solder connection
助焊剂剩余﹕ flux residue
焊料裂纹﹕ solder crazeing
焊角翘起﹕ fillet-lifting ；lift-off