平面凸点封装叶酸结合蛋白（FlatBumpPackage）是一种新的软件包，这是鉴于目前的QFN封装在根本上解决这一问题的一些（QuadFlatNo无铅）封装技术，无法重新选择的设计。

我们知道QFN封装有效的空间利用铅脚封装，从而大大提高包装效率。然而，QFN封装半导体封装制造工艺大多数制造商面临着一些混乱，因为现有的QFN封装封装过程，以避免溢出时，塑料树脂，带头脚，一般是在引线框架用（长/女）加回高温度膜封装的方法来阻止自由流动时，树脂，在解决上述问题，这种方法导致了进一步的一系列技术问题：{dy}，目前的高温塑料薄膜温度不应超过270℃，因而只适合加载的QFN封装导电胶薄膜技术，半导体封装和软共晶焊接工艺可以使用该技术，使包装和导热性能受到限制，二是在播放焊接电源将耐高温膜吸收，导致减少焊接牢度（金线测量下降克拉），在塑料封装金线是推力塑料（图1甲），而更为严重的是产品检测，但对存在隐患的可靠性通过;有三个封装时注射压力不应该与传统的半导体过程控制的规定，否则，他们将有一个更高的塑料树脂，甚至导致金属铅脚脚溢流面现象，是过多的胶水的问题，适合高温处理，如膜和引线框架有点紧张，这种现象更明显（图1乙），从而增加了难度后处理工艺和成本; 4塑料如溢出不彻底的xx将是最终产品的表面贴装导致在这一过程中技术（SMT）不良容易焊接，5减少是由于注射压力，影响身体的塑料密度，结果的可靠性问题; 6 QFN的信用证/ F需要设计，甚至肌腱，以确保在包装过程升/ F至保持一定的形状，电镀传导电流时，会导致每只脚，而升/即使在切割肌腱F将有一个锡罐熔化，毛刺，甚至引起短路乘坐锡（图1 C号），加强了在同一时间切割切割刀片，即使他们可以很容易磨损，从而提高了生产成本，有7部影片采用高温提高产品的制造成本。

改变这一切，我们必须打破的设计和技术创新的传统思想的束缚。

叶酸结合蛋白基本思路是：升/金属材料F到形成自己的选择高温薄膜塑料薄膜，它是否能解决QFN封装一系列问题，上述生产过程？我们知道QFN封装引线框架本身是，如果我们引线框架蚀刻蚀刻当它不应该被允许渗透，并在底部保留的厚度

The form of a new type of semiconductor packaging FBP

Flat Bump Package FBP (FlatBumpPackage) is a new kind of package, it is the view of the current QFN (QuadFlatNo-lead) packaging technology in some of the fundamental solution to the problem can not be re-select design.

we know QFN package effective use of a lead foot package of space, thus significantly improve the efficiency of the package. However, most manufacturers QFN semiconductor packaging manufacturing process technology is faced with some confusion, because the existing QFN encapsulation process in order to avoid overflow when the plastic resin to the lead foot, generally used in the lead frame (L / F) add back high temperature membrane encapsulation of methods to block the free flow when the resin, and this method in solving the above problems has led to a further series of technological problems: First, the current high temperature plastic film temperature should not exceed 270 ℃ , thus only suitable for QFN loaded conductive adhesive film technology, and semiconductor packaging and soft eutectic solder process can use the technology, so that packaging and thermal conductivity properties are subject to the restrictions; Second, when playing Welding power will be high temperature resistant film absorption, resulting in decreased welding fastness (measured Anoectochilus decline carats), golden thread in the plastic encapsulation was thrust plastic (Figure 1 A), while the more serious are Products Detected But the adoption of the reliability of the existence of hidden dangers; are three encapsulation when the injection pressure should not in accordance with conventional semiconductor process control, otherwise they will have a higher plastic resin and even metals lead foot to lead foot overflow surface phenomenon that is the issue of excess glue , high temperature processes such as membrane and lead frame fit a little tight, this phenomenon more apparent (Figure 1 B), thus increasing the difficulty of post-treatment processes and costs; four plastic such as overflow are not thorough treatment will be the final product resulting in surface mount technology (SMT) in the process of non-performing easy solderability; five are due to reduce the injection pressure, the density of the plastic body affected, resulting in reliability problems; six QFN are the L / F must be designed to even the tendons in order to ensure packaging process in L / F to maintain a certain shape and electroplating conduction when the current can lead to each foot, while the L / F of even the tendons in the cutting will have a melt tin, burr and even give rise to short-circuit ride tin (Figure 1 C), at the same time cutting blade in cutting reinforced even when they can easily wear, resulting in increased manufacturing costs; are seven films using high temperature enhance the product’s manufacturing cost.

to change all this we must break the shackles of traditional thinking, in the design and technology innovation.

FBP basic ideas are: The L / F of the metal material to form their own alternative high temperature thin-film plastic film, whether it can address the above-mentioned production process QFN a series of problems? We know QFN lead frame itself is from copper alloy or iron-nickel alloy etching produced the way, if we lead frame etching etching when it should not be allowed to penetrate, and in the bottom to retain a certain degree of thickness (0.02mm-0.06mm ), in the loaded film, playing lines, a series of plastic packaging process after the etching method to use to generate leads that we want to foot shape, this is not a viable technology path?

Electricity Technology Co., Ltd. Jiangsu long made repeatedly in this certification and testing, combined with the packaging industry and other process manufacturing industries, and achieved a crucial breakthrough, and thus a growth-promoting new forms of packaging that is FBP.

FBP and QFN similar appearance (Figure 2), pin can also be one-to-one, and its appearance from QFN main difference is: the traditional pin QFN plastic at the bottom of the foot and in the same plane, while FBP is the lead foot protruding from the plastic at the bottom, so that with SMT solder combination with the IC surface from two-dimensional into three-dimensional (figure III), so in the PCB assembly process effectively reduces the possibility of虚焊; at the same time FBP is currently used are gold-plated technology, in the realization of lead-free at the same time do not raise the temperature will be able to realize reliable welding, thereby reducing the circuit board assembly plant related problem, so that circuit boards, higher reliability.

FBP process technology is a key film, exposure and etching, which is FBP technology with traditional IC Packaging Technology The biggest difference, other processes with similar traditional IC packaging technology.

due to FBP’s feet are outside the wire through the metal surface by etching, so outside the lead foot Coplanarity fairly consistent; and as a result of FBP the L / F structure has changed, FBP did not play before the line necessary to carry out plasma cleaning, and related test data such as test-carat gold wire, and pushed the ball edge is obviously superior to QFN. The following table is the golden thread Φ25 on the same wire bonders carats produced in our data contrast measurement:

process using FBP principle we can also derive some other useful products such as packaging HBGA. FBP framework we know that the bottom has a layer of metal are linked, so that the FBP framework to ensure that each lead foot has enough mechanical strength, so everyone can design lead foot surface in the entire package of arbitrary positions, which makes with a metal L / F production BGA possible (traditional BGA substrate with multi-layer epoxy to carry chips and lead solder), the use of metal L / F The greatest benefit is to raise the BGA package, heat dissipation, so we it named HBGA (High-PowerBumpGridArray), at the same time because the use of a metal L / F to replace the multi-layer epoxy substrate, HBGA manufacturing costs are also lower than the traditional BGA and metal L / F of water absorption was significantly lower than epoxy substrates, therefore, compared with the traditional BGA reliability HBGA higher.

with FBP as, HBGA are in our country in the field of semiconductor packaging one of the few independent intellectual property products, demonstrates China’s semiconductor industry by studying advanced foreign technology to the development trend of independent innovation, and as a domestic semiconductor packaging length of the leading enterprises in Jiangsu Electricity Technology Co., Ltd., is also ready to use the advantages of this technology further to create world-class enterprises, a new image package, long electric technology has been developed from FBP0.8 * 0.6 * 0.45 to FBP9 * 9 * 0.85 a series of more than 20 kinds of FBP package, package pin from 2PIN until 64PIN, can be used eutectic, conductive adhesive films loaded different ways for customers processing different types of integrated circuits, diodes and transistors, reliability of the current FBP1.2 * 1.2 * 0.5, FBP1.6 * 1.6 * 0.5, FBP3 * 3 * 0.85 through MSLLEVEL1 examination, assessment of other products also under way. From the angle of green electricity long FBP technology products are eco-friendly materials selection, product standards have been SONY pass the SGS Detect. FBP long electric technology production line will also be set up by the end of October 2005.

continuously improve packaging efficiency are the eternal pursuit of semiconductor packaging, from the early series of DIP to SOP Series, QFP series, to the recent QFN series, FBP Series, BGA series and HBGA, as well as the development of WLCSP series, 3D packaging, realize the same functions required to package size is increasingly reduced, but in general the form of a new package in the early stages of the formation of the total cost of the increase in mean and standard to be set up, process to be sophisticated and reliability to be tested, FBP with QFN, BGA, WLCSP, 3D package, like technology and market experience necessary harsh test, but from the manufacturing processes of fluency, product reliability, cost and other multi-angle comparison, FBP undoubtedly have a considerable advantage, and the FBP can also use pure copper as the L / F material, in the emerging radio frequency (RF) field of more superiority, we have reason to believe that FBP in the next package to be a growing area of The more widely used. (07-11-27)