RoHS豁免清单更新  条款已达39项

RoHS豁免 LED中镉

2010.2.26，欧盟在官方公报上公布委员会决定2010/122/EU，鉴于对LED中的镉进行替代，在技术上还不成熟，决定对其进行豁免。至此，RoHS指令附录（即豁免清单)条款，增加至第39条。

RoHS{zx1}豁免清单

1.   Mercury in compact fluorescent lamps not exceeding 5 mg per lamp 小型日光灯中的汞含量不得超过5毫克/灯  

2.   Mercury in straight fluorescent lamps for general purposes not exceeding:  halophosphate 10 mg,

triphosphate with normal lifetime  5 mg , triphosphate with long lifetime  8 mg. 一般用途的直管日光灯中的汞含量不得超过：  盐磷酸盐10毫克,  正常的三磷酸盐5毫克 , 长效的三磷酸盐8毫克 .

3.   Mercury in straight f1uorescent lamps for special purposes 特殊用途的直管日光灯中的

汞含量

4.  Mercury in other lamps not specifically mentioned in this Annex. 本附录中未特别提及的其它

照明灯中的汞含量

5.   Lead in glass of cathode ray tubes, electronic components and f1uorescent tubes. 阴极射线管、电子部件和发光管的玻璃内的铅含量

6. Lead as an alloying element in steel containing up to 0.35% lead by weight, aluminium containing up to 0.4% lead by weight and as a copper alloy containing up to 4% lead by weight.钢中合金元素中的铅含量达0.35%，铝含量达 0.4%，铜合金中的铅含量达4%

7.   Lead in high melting temperature type solders (i.e.lead-based alloys containing 85 % by weight

or more lead); lead in solders for servers, storage  and storage array systems, network infrastructure equipment for switching,  signalling, transmission as well as  network management for Telecommunications; lead in electronic ceramic parts (e.g. piezoelectronic devices).

高温融化型焊锡铅（如：铅含量≥85%的合金中的铅）；用于服务器，存储器和存储阵列的焊料中的铅。用于交

换、信号产生和传输，以及电信网络管理的网络基础设施设备中焊料中的铅； 电子陶瓷部件中（如：高压

电子装置）的铅   

8. Cadmium and its compounds in electrical contacts and cadmium plating except for applications banned under Directive 91/338/EEC amending Directive 76/769/EEC relating to restrictions on the marketing and use of certain dangerous substances and preparations 电触点中的镉及镉化合物以及91/338/EEC  指令限制范围以外的镉电  

9.   Hexavalent chromium as an anti-corrosion of the carbon steel cooling system in absorption

refrigerators.  在吸收式电冰箱中作为碳钢冷却系统防腐剂的六价铬； 

9a DecaBDE in polymeric applications; (2005/717/EC) 聚合体中使用的十溴二苯醚(2005/717/EC)（豁免至

2008.6.30)

9b Lead in lead-bronze bearing shells and bushes. (2005/717/EC) 在铅-铜轴承外壳与衬套中的

铅(2005/717/EC)  

10.   Within the procedure referred to  in Article 7(2),the Commission shall evaluate the applications for: (2005/717/EC)  mercury in straight fluorescent lamps for special purposes, light bulbs, as a matter of priority in order-to establish as soon as possible whether these items are to be amended accordingly.

根据在第7(2)条中提及的程序，欧盟委员会应评价以下方面的应用(2005/717/EC)： 特殊用途的直管荧光灯中的

汞；

11.   Lead used in compliant pin connector systems.(2005/747/EC) 插脚式连接器系统中使用的铅；(2005/747/EC)

12.   Lead as a coating material for the thermal conduction module c-ring. (2005/747/EC) 热导模组C环涂层中所用的铅；(2005/747/EC)

13.   Lead and cadmium in optical and filter glass. (2005/747/EC) 光学玻璃及滤光玻璃中所用的铅及镉；(2005/747/EC)

14.   Lead in solders consisting of more  than two elements for the connection between the pins and

the package of microprocessors with a lead content of more than 80% and less than 85% by weight. (2005/747/EC) 微处理器针脚及封装联接所使用的含两种以上组分的焊料中的铅（铅含量在80%和85%之间）；(2005/747/EC)

15.   Lead in solders to complete a viable electrical connection between semiconductor die and

carrier within integrated circuit Flip Chip packages. (2005/747/EC)集成电路倒装芯片封装中半导体芯片及载体之间形成可靠联接所用的铅；(2005/747/EC)

16.   Lead in linear incandescent lamps with silicate coated tubes.(2006/310/EC) 线形白炽灯硅酸盐灯管中的铅；(2006/310/EC)

17. Lead halide as radiant agent in  High Intensity Discharge(HID) lamps used for professional

reprography applications. (2006/310/EC) 用于专业复印设备的高强度放电灯(HID)中用作激发的卤素铅；(2006/310/EC)

18.   Lead as activator in the  fluorescent powder (1% lead by weight or  less) of discharge amps when used as sun tanning lamps containing phosphors such as BSP(BaSi2O5:Pb) as well as when used as

speciality lamps for diazo-printing  reprography, lithography, insect traps,photochemical and curing  processes containing phosphors such as SMS((Sr,Ba)2MgSi2O7:Pb)(2006/310/EC) 当放电灯被用作含磷的仿日晒灯(sun tanning lamps)，比如含有BSP(BaSi2O5:Pb)， 以及用于重氮复印、平版印刷、捕虫器、光化

学和食物加工过程的特种灯，含有磷时，比如SMS((Sr,Ba)2MgSi2O7:Pb)，放电灯中的荧光粉触媒剂的铅含量在

其重量的1％或以下；(2006/310/EC)

19.   Lead with PbBiSn-Hg and PbInSn-Hg  in  specific compositions as main amalgam and with  PbSn-Hg  as  auxiliary  amalgam  in  very  compact  Energy  Saving  Lamps  (ESL). (2006/310/EC) 紧凑型节能灯(ESL)中作为主要汞齐合金的特定成分(PbBiSn-Hg和PbinSg-Hg)中的铅以及作为辅助汞合金PbSn-Hg中的铅；

(2006/310/EC)

20.   Lead oxide in glass used for bonding front and rear substrates of flat fluorescent lamps

used for Liquid Crystal Displays (LCD).(2006/310/EC) 液晶显示器(LCD)用于连接平面荧光灯前后基片用的玻璃中的氧化铅；(2006/310/EC)

21.   Lead and cadmium in printing inks for the application of enamels on borosilicate glass.

(2006/691/EC) 用于硼硅酸盐玻璃瓷漆的印墨所含的铅及镉；(2006/691/EC)

22.   Lead as impurity in RIG (rare earth iron garnet) Faraday rotators used for fibre optic

communications systems. (2006/691/EC) 在光纤通讯系统稀土铁石榴石法拉第旋转器中作为杂质的铅；(2006/691/EC)（豁免至2011.1.1）

23.   Lead in finishes of fine pitch components other than connectors with a pitch of 0.65mm or less with NiFe lead frames and  lead in finishes of fine pitch components other  than connectors with a pitch of 0.65 mm or less with copper lead frames. (2006/691/EC) 使用铁镍合金或者铜引线框架的细间距元器件（即不大于0.65mm的引脚间距）的表面处理中的铅，不包括连接器类；(2006/691/EC)

24.  Lead in solders for the soldering to achined through hole discoidal and planar array ceramic multilayer capacitors. (2006/691/EC) 通孔盘状及平面阵列陶瓷多层电容器焊料所含的铅；(2006/691/EC)

25.   Lead oxide in plasma display panels  (PDP) and surface conduction electron emitter displays (SED) used in structural elements; notably in the front and rear glass dielectric layer, the bus electrode, the black stripe, the address electrode, the barrier ribs, the seal frit and frit ring as well as in print pastes. (2006/691/EC) 等离子显示屏（PDP）及表面传导式电子发射显示器（SED）的部件中的氧化铅，特别是玻璃前后绝缘层、总线电极、黑条（彩色显像管）、寻址电极、阻挡层肋柱、密封玻璃料以及封装玻璃、环状玻璃、印墨中；(2006/691/EC)

26.   Lead oxide in the glass envelope of BlackLight Blue (BLB) lamps. (2006/691/EC) 蓝黑灯管（BLB）玻璃外罩所含的氧化铅；(2006/691/EC)

27.   Lead alloys as solder for transducers used  in high-powered (designated to operate for

everal hours at acoustic power levels of 125 dB  SPL and above) loudspeakers.(2006/691/EC) 在大功率扬声器中作为转换器焊料的铅合金；(2006/691/EC)

28.   Hexavalent chromium in corrosion preventive coatings of unpainted metal sheetings and fasteners used for corrosion  protection and Electromagnetic Interference Shielding inequipment falling under

category three of Directive 2002/96/EC (IT and telecommunications equipment).Exemption granted until 1 July 2007. (2006/692/EC) 2002/96/EC指令（IT及电信设备）涉及的第三类设备中用来防止腐蚀和干扰的未喷漆金属薄板及紧固件上防腐涂层中的六价铬。(2006/692/EC)( 豁免至2007.7.1)

29.   Lead bound in crystal glass as defined in Annex I (Categories 1, 2, 3 and 4) of Council Directive 69/493/EEC. (2006/690/EC ) 理事会指令69/493/EEC附件I（第1、2、3和4类）中定义的水晶玻璃中的铅(2006/690/EC)

30.   Cadmium alloys as electrical/mechanical  solder joints to electrical conductors located

directly on the voice coil in transducers used in high-powered loudspeakers with sound pressure levels of 100 dB (A) and more. (2008/385/EC ) 用于音压在100分贝以上的大功率扬声器，在变频器中直接装置

到受话器的上，作为电气/机械焊料的镉合金；(2008/385/EC)

31.   Lead in soldering materials in mercury free flat fluorescent lamps (which e.g. are used

for liquid crystal displays, design or industrial lighting). (2008/385/EC ) 无汞平板荧光灯内焊接材料中的铅（例如用于液晶显示器、设计或工业用明）；(2008/385/EC)

32.   Lead oxide in seal frit used for making window assemblies for Argon and Krypton laser tubes. (2008/385/EC) 用于氩和氪激光管窗体组件制造的密封釉料中的氧化铅；(2008/385/EC)

33.   Lead in solders for the soldering of thin copper wires of 100μm diameter and less in

power transformers. 直径100微米的细铜线和小于直径100微米的电力变压器的焊料中的铅；

34.   Lead in cermet-based trimmer potentiometer elements. 金属陶瓷质的微调电位器中的铅含量；

35.   Cadmium in photoresistors for optocouplers applied in professional audio equipment until 31 December 2009. 专业音频设备中的光耦合器的元件、光电阻的镉的应用（豁免至2009.12.31）

 36.   Mercury used as a cathode sputtering inhibitor in DC plasma displays with a content up to 30 mg per display until 1 July 2010. 直流等离子显示器中，作为阴极溅射抑制剂中的汞在第个显示器中的含量不得超过30毫克（豁免至2010.7.1）

37.   Lead in the plating layer of high voltage diodes on the basis of a zinc borate glass body

以硼酸锌玻璃体为基础的高压二极管的电镀层的铅含量

38.Cadmium and cadmium oxide in thick film pastes used on aluminium bonded beryllium oxide. 用氧化铍连接铝制成的厚膜浆料中镉和xxx的含量  

39.Cadmium in colour converting II-VI LEDs (< 10 μg Cd per mm2 of light-emitting area) for use in solid state illumination or display systems until 1 July 2014 用于固态照明或显示使用系统中的彩色转换II - VI族发光二极管(小于10微克每平方毫米的发光区域)内所含的镉（豁免至2014.7.1）

(以上中文翻译仅供参考，如有歧义，请以英文原文为准)

2009底，欧盟议会议员提出一份修订报告，针对2008年12月3日欧盟执委会公告的RoHS修正草案进行大幅修订。在此份修订报告中，RoHS将扩大管制范围，并在电子电气产品中新增更多有害物质的限制。作为企业得以{zd0}限度降低RoHS指令影响，为产品出口赢得转机的利好参考，RoHS豁免清单的任何细微调整，企业都应引起足够重视。针对可豁免项目，提出如下建议：

要充分了解熟悉RoHS指令的豁免清单和豁免期限，提高合理利用豁免规则的意识，积极为自己的产品申请豁免以争取更宽阔的生存空间；

加强供应商采购控制管理，尽可能要求提供原材料成分声明，采购达到RoHS要求的元器件和原材料，对不确定的供应商材料要进行内外部测试，确保不掺杂有害物质以符合申请豁免条件；

豁免项目针对的是产品中的特定有害物的应用，而非整个产品被豁免，如一零部件中焊料中的铅是符合RoHS指令的，但不代表该零部件产品就能被豁免，同一部件中仍不能含有其它限制形式的铅或其它五种被限制物质。

据悉，欧盟暂定2010.5.4，对RoHS修订报告进行一读程序，5.18进行全体会议。