半导体元器件塑料封装设备,满足了客户在成型作业上的需求，实现单转进注胶与多转进注胶系统(MGP系统)的兼用性，大大提高了生产效益。可以定制 35T--300T 模机。
Plastic sealed casting machine for semiconductor components.To meet the demands of forming operation, we have realized the combination of single transfer injection and MGP system with 35mt to 300mt power mold, which greatly improve the production benefit.
Inquiry a price or place an order please contact us by Tel 86-755-81697227 or email us :
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