Aging test system of aging rack may affect the overall performance? What factors affect the overall performance of the aging test system.

1. The first is the choice of test method.

    Ideally, the device takes the least time in the aging process, which can improve the overall output. Poor electrical performance conditions help to accelerate the occurrence of faults, so systems that can be tested repeatedly quickly can reduce the overall aging time. The more switching times of internal nodes per unit time, the greater the test of the device, and the faster the failure occurs.

2. Interconnection of aging board, PCB design and complexity of bias circuit.

    The aging test system may be called high-speed test by some people, but if the mechanical connection or the characteristics of the aging plate will weaken the signal quality, then the test speed will be a problem. For example, too many mechanical and electrical connections will increase the total capacitance and inductance of the whole system, bad design of aging board will generate noise and crosstalk, and poor design of pin driver will limit the fast signal along the required driving current, etc., which are only bottlenecks affecting speed. In addition, due to too large load, there are impedance, circuit offset and protection The selection of protection component value will also affect the aging performance.

3. Ability to download and convert high-speed tester program.

    Some aging testing systems have their own testing language, and do not need to develop programs for the tested devices that need to do {bfb} node switching; while some systems can directly convert the high-speed tester program to aging application, and can conduct more accurate testing in the aging process.

4. The system provides the ability of parameter test.

    If the aging test system can carry out some speed tests, it can also get some other relevant failure data for reliability research, which also helps to simplify the post aging test process.

5. The ability to dynamically test parameters such as voltage and frequency according to time.

    If the aging test system can change the parameters in real time, it can speed up the occurrence of faults which usually belong to the later stage of product life. For some device structures, DC voltage bias and power variation of dynamic signal can accelerate the occurrence of late life fault.