TDK电容CGA5L3X7R1H475K160AB 1206 X7R 50V 4.7UF10%
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图片仅供参考，并展示示范产品。 |
| 长度(L) | 3.20mm +0.30,-0.10mm |
| 宽度(W) | 1.60mm +0.30,-0.10mm |
| 厚度(T) | 1.60mm +0.30,-0.10mm |
| 端子宽度(B) | 0.20mm Min. |
| 端子间隔(G) | 1.00mm Min. |
| 推荐焊盘布局(PA) |
2.10mm to 2.50mm(Flow Soldering) 2.00mm to 2.40mm(Reflow Soldering) |
| 推荐焊盘布局(PB) |
1.10mm to 1.30mm(Flow Soldering) 1.00mm to 1.20mm(Reflow Soldering) |
| 推荐焊盘布局(PC) |
1.00mm to 1.30mm(Flow Soldering) 1.10mm to 1.60mm(Reflow Soldering) |
| 电容 | 4.7μF ±10% |
| 额定电压 | 50VDC |
| 温度特性 ? | X7R(±15%) |
| 耗散因数 (Max.) | 5% |
| 绝缘电阻 (Min.) | 106MΩ |
| 温度范围 | -55～125°C |
| 焊接方法 | 流体回流 |
| AEC-Q200 | YES |
| 包装形式 | 塑封编带 (180mm卷筒) |
| 包装个数 | 2000pcs |
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