KESTER 186凯斯特松香助焊笔 10ML ROSIN FLUX TYPE RMA

186 Flux Pen®专为传统和表面贴装电路板组件的含铅和无铅返工而设计。

186根据MIL-F-14256，被QPL批准为RMA型。虽然助熔剂的能力接近于RA型焊剂，但钎焊后的残留物无腐蚀性和不导电性。

186已开发用于焊接困难组件的关键应用，但工艺要求规定使用RMA型焊剂。

186具有较高的热稳定性，用于焊接需要较高温度的多层组件。暴露在高温下不会降低残渣在正常清洗溶剂中的溶解度。焊剂残留物不会导致表面绝缘电阻退化。使用最少的离子活化剂和残余物的非活性性质允许残余物留在电路板组件上用于许多应用。助焊剂残留物还具有防潮和抗xx性。

 186 Flux Pen® is specifically designed for leaded and lead-free rework of conventional and surface mount circuit board assemblies.

186 under MIL-F-14256, was QPL approved as Type RMA. Although the fluxing ability approaches that of Type RA flux, residues after soldering are non-corrosive and non-conductive.

186 has been developed for use in critical applications where difficult assemblies are to be soldered, but process requirements stipulate use of Type RMA flux.

186 possesses high thermal stability for soldering multi-layer assemblies which require higher temperatures. Exposure to high preheat temperatures does not degrade solubility of the residue in normal cleaning solvents. There is no surface insulation resistance degradation caused by the flux residue. The use of a minimum of ionic activating agents and the inactive nature of the residue permits leaving the residue on circuit board assemblies for many applications. The flux residue is also moisture and fungus resistant.