江苏南京gap filler1500公司

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    苏州萨菲德新材料科技有限公司

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    SK-1350 GF Thermal Gap Filler(导热凝胶)
    Blue / Two Part Silicone-based / Thermally Conductive Gap Filler

    INTRODUCTION         SK-1350 GF Thermal gap filler is a two part liquid silicone-based material, curing at room temperature once mixed. SK-1350 GF is a soft and compressible material designed to dissipate heat from electronic devices such as PCB modules by conducting it to a heat sink such as an aluminum housing. 

    Unlike cured thermal pad materials, SK-1350 GF thermal gap filler is supplied as a      two-part liquid component kits. When the liquid components are thoroughly mixed either by weight or volume, the mixture cures to a soft elastomer. These elastomers cure without exotherm at a constant rate regardless of sectional thickness or degree of confinement. SK-1350 GF has long term performance stability during temperature cycling up to 200℃. 

    SK-1350 GF thermal gap filler is used for smartphones, portable computing devices, LED lighting modules, PCB modules, communication equipment and electric vehicle parts, provide a reliable cooling solution.
    Two-part 1 : 1
    Low interface stress 
    Optimized dispensing Thermal conductivity 3.5 W/m.K
    Room temperature curing
    Easy to rework 
    FEATURES

    Portable electronics
    LED lighting modules
    SSD Automotive electronics
    Telecommunications
    ECU BMS
    TYPICAL APPLICATIONS

    TYPICAL PROPERTIES
    Test Item Data Test Item Data
    Composition Silicones Hardness 40  Shore OO
    Appearance A : White / B : Blue Volume Resistivity ≥1.0*1012  Ω.cm
    Mix Ratio by Weight A:B=1:1 Dielectric Constant 7.0 (@1 MHz)
    Specific Gravity 3.0 g/cm3 Dielectric Strength  ≥10 KV (@1mm)
    Viscosity @ 25℃ 150,000 cPs Use Temperature range -60 - 200℃
    Thermal Conductivity 3.5 W/m.K Flammability Rating V-0
    Thermal Resistance Min. (@50psi) ≤0.06 ℃ in2/W Low Volatility Content(D4-D20) ≤100 ppm
    THERMAL RESISTANCE                                                                     Units: ℃ in2/W
    Compression 0.1mmT 0.2mmT 0.3mmT 0.5mmT 1.0mmT 1.5mmT 2.0mmT 3.0mmT 4.0mmT 5.0mmT
    20 psi 0.08  0.15  0.22  0.31  0.40  0.50  0.59  0.78  0.97  1.15 
    50 psi 0.07  0.12  0.19  0.28  0.36  0.45  0.54  0.70  0.88  1.03 
    DEFLECTION VS.PRESSURE(after cure)                                                      Units: psi
    Compress Rate  0.5mmT 1.0mmT 1.5mmT 2.0mmT 2.5mmT 3.0mmT 4.0mmT 5.0mmT 8.0mmT
    10% 10.3  7.2  6.5  5.9  5.3  5.0  4.7  4.3  4.0 
    20% 40.5  21.2  16.7  13.5  12.2  9.6  8.5  7.3  5.8 
    30% 82.8  40.5  32.6  28.5  20.2  18.6  16.7  14.9  11.3 
    40% 126.4  63.6  48.8  40.6  33.3  29.2  26.7  20.5  18.9 
    50% 152.6  95.2  68.5  57.6  48.5  40.2  34.6  30.3  26.1 
    Sustain 50% 90.5  56.2  40.6  34.2  28.7  23.5  20.7  17.8  14.7 
    RELIABILITY     
    Properties Units Initial 180℃ aging 85℃/85%RH -40℃(30min)←→ 150℃(30min)
       after 1000hrs after 1000hrs after 1000hrs
    Thermal Conductivity W/m.k 3.51 3.62 3.55 3.59
    Thermal Resistance ℃ in2/W(@1mm) 0.402 0.415 0.406 0.403
    Hardness Shore OO 40 50 44 46
    Volume Resistivity Ω.cm 1.3*1012  3.5*1012 2.3*1012 1.8*1012
    Dielectric Strength kv(@1mm) 10.9 11.6 10.9 11.1
      Thermal Resistance vs.Thinknes

    Test method:Safid Test method,which is ASTM D5470 modified.   Specimen Area:DIA.25.0mm(1.0in).
    DATADEFLECTION VS. PRESSURE
    Test method:Safid Test method,which is ASTM D575-91 for reference.
    Specimen Area:DIA.28.6mm(1.13in).
    Platen Area:DIA.28.6mm(1.13in).
    Sustain 50%:Sustain 50% at 1min later.
    Compression Velocity:5.0mm/min.

    HOW TO USE Mix ratio Two part,A:B=1 : 1 (by weight/volume)
    Pot life
    Cure Condition 60 min  @ 25℃
    8 hours @ 25℃ or  20~25 minutes @ 100℃

    STORAGE 1.Containers should be kept tighly closed and head or air space minimized.
    2.Shelf life is 6 months after the packaged date.

    PACKAGING
     Available packaging size
    50cc dual cartridge kit
    400cc dual cartridge kit
    10 gallon kit 

    LIMITATIONS This product is neither tested nor represented as suitable for medical or pharmaceutical uses.

    LIMITED WARRANTY
    INFORMATION The information contained herein is offered in good faith and is believed to be accurate. However, because conditions and methods of use of our products are beyond our control, this information should not be used in substitution for customer’s tests to ensure that our products are safe, effective, and fully satisfactory for the intended end use. Suggestions of use shall not be taken as inducements to infringe any patent. Safid’s sole warranty is that our products will meet the sales specifications in effect at the time of shipment. 



     

    苏州萨菲德新材料科技有限公司是一家集研发、制造、销售为一体的新型材料生产企业;
    多年来,公司一直致力为客户提供全面的导热缓冲及粘接、密封、涂覆材料等解决方案;
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    企业宗旨:以质量求生存,靠信誉求发展;以行动履行了我们的诺言,经实践证实了我们的质量。 
    企业的工作理念(LRHEE):诚信、求实、和谐、{gx}、创新。
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    联系人:方经理 联系电话:18550383598

    导热凝胶:www.safid.com.cn
    导热片:www.safid.com.cn
    gap filler:www.safid.com.cn

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