上料机/Loader
面议
|
设备外形尺寸/Equipment Dimensions (mm)
|
WxLxH:1000x1300x1600
|
|
设备正压/ Positive Pressue (Kpa)
|
0.4~0.6
|
|
设备负压/Negative Pressure (-Kpa)
|
0.1~0.4
|
|
设备总功率/Total Power (KW)
|
1.5kw
|
|
硅片尺寸/Wafer Size (mm)
|
125x125,156x156,210x210
|
|
硅片厚度/Wafer Thickness (μm)
|
100~400
|
|
产能/小时/Capacity/ hour
|
3000
|
|
印刷精度/Printing Accuracy (mm)
|
±0.025
|
|
具体细项/Item
|
控制方式/Control mode
|
体现优点/Advantage
|
|
放板方式
Place the board
|
整叠硅片放在固定冶具中
Place whole stack of wafer in the jig
|
可以一次性放大量硅片,而且无需人为插件或是专门设备进行插件.可以减少人为因素或是设备成本.
Can place a large number of wafers on one-time, no need plug-in by manual mode or plug-in by specialized equipment. Reduce personal factor or equipment cost.
|
|
取板方式
Put out the board
|
同步吸取与放置
Absorb and place synchronously
|
同步吸取与放置:当一边放置硅片到运输轨道时,另一边同时在吸取硅睡,这样没有浪费中间的控制时间,可以更快速的吸取硅片,提高产能.
When one side place wafer on the conveyor, another side absorb wafer at the same time. Save control time, absorb wafer faster, increase production capacity.
|
