供应乐泰乐泰单组份模组胶，低温固化黑胶、乐泰3128MSDS 乐泰3220 GSG
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LOCTITE 3128 is a one part, heat curable epoxy. This
product is designed to cure at low temperature and gives
excellent adhesion on a wide range of materials in
considerably short time. Typical applications include Memory
cards, CCD/CMOS Assemblies. Particularly suited where low
curing temperatures are required for heat sensitive
components.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Specific Gravity @ 25 °C 1.6
Yield Point, 25 °C, mPa
Cone & Plate Rheometer
44,000
Casson Viscosity @ 25 °C, mPa·s (cP)
Cone & Plate Rheometer
7,000 to 27,000LMS
Pot life @ 25 °C, weeks 3
LOCTITE3220
With all curing systems, the time required for cure depends on the rate
of heating. Cure rate depends on the mass of material to be heated
and intimate contact with the heat source. Use suggested cure
conditions as general guidelines. Other cure conditions may yield
satisfactory results.
The above cure profiles are guideline recommendations. Cure
conditions (time and temperature) may vary based on customers'
experience and their application requirements, as well as customer
curing equipment, oven loading and actual oven temperatures.
